Lasering
High-end depanelling from the Black Forest
The speedLAS technology enables exceptionally high cutting speeds through innovative superimposition of the laser beam with the movements of the axes.
The non-contact process avoids mechanical stress and protects the integrity of sensitive components.
The laser process vaporises the material and efficiently removes the vapours, preventing malfunctions caused by deposited dust.
Laser depanelling offers almost unlimited design freedom for PCBs and enables minimal distances between the cut edges and the components.
Los sistemas láser funcionan sin desgaste, lo que reduce la intervención adicional del usuario y los costes.