The laser's fine beam ensures precise, high-quality material processing. Furthermore, avoiding material fusion at the cutting edge prevents fraying, ensuring a smooth component edge.

With the Medical Grade Cut, SCHUNK sets new standards in the highest quality of material processing. This cut is completely free of carbonization and ensures unparalleled purity and precision. Due to these outstanding properties, the Medical Grade Cut is particularly suitable for demanding applications in medical technology where the highest levels of cleanliness and precision are essential.

SCHUNK's speedLAS technology revolutionizes the cutting process through the innovative combination of the laser beam with axis movements using a scanner. This advanced process enables exceptionally high cutting speeds without sacrificing precision.
This ensures efficient, high-quality material processing, making speedLAS the ideal solution for modern manufacturing requirements.

Unlike mechanical methods, the non-contact process for separating the printed circuit boards from the panel avoids any transfer of mechanical stress to the material.
This fully preserves the integrity of sensitive components and prevents potential damage.

Mechanical processes, such as milling, generate dust particles during the manufacturing process. In laser processing, however, the material is vaporized, and the resulting fumes are efficiently removed by an extraction system.
This reliably prevents potential malfunctions caused by deposited dust particles.

Laser depaneling allows various base materials to be processed effortlessly by adjusting the process parameters, without the need for additional tools or special systems. The development of new applications, such as those in the high-frequency range, requires special materials that must be precisely tailored to individual requirements.
Such sensitive and demanding materials are only partially processable using traditional mechanical methods. In these application areas, laser depaneling proves to be the optimal solution.

In contrast to mechanical processes, laser depaneling offers virtually unlimited design freedom for PCBs. Thanks to the flexible line guidance and the fine diameter of the laser beam, even very fine and complex structures can be effortlessly realized.
The precise laser also makes it possible to minimize the distances between the cut edges and the components and maximize the maximum permissible assembly height. Consideration of minimum radii or land widths, as required, for example, with milling, is completely eliminated.

Laser systems are wear-free, meaning tools such as milling heads or saw blades don't need to be replaced.
This eliminates additional user intervention and the associated costs. Furthermore, the elimination of wear parts ensures consistently high quality over a long period of time.